PARAMETER	SYMBOL	DEVICES	TYP.	MAX.	UNIT	Test condition
Forward Voltage(one Dice Per Segmen/Dot)	VF	SUPER HIGH BRIGHT RED(ALGalnP)	2.0	2.4	V	IF=20mA
		HIGH BRIGHT RED(GaP/GaALAS)	1.85	2.0
		ORANGE RED(AaAsP/GaP)	2.05	2.4
		YELLOW(GaAsP/GaP)	2.05	2.4
		YELLOW GREEN(GaP/GaP)	2.2	2.6
		BLUE(Gan)	3.3	3.8
Peak Emission Wavelength	lP	SUPER HIGH BRIGHT RED(ALGalnP)	640		nm	IF=20mA
		HIGH BRIGHT RED(GaP/GaALAS)	660
		ORANGE RED(AaAsP/GaP)	625
		YELLOW(GaAsP/GaP)	585
		YELLOW GREEN(GaP/GaP)	570
		BLUE(Gan)	470
Spectral Line Half-Width	Dl	SUPER HIGH BRIGHT RED(ALGalnP)	20		nm	IF=20mA
		HIGH BRIGHT RED(GaP/GaALAS)	20
		ORANGE RED(AaAsP/GaP)	40
		YELLOW(GaAsP/GaP)	35
		YELLOW GREEN(GaP/GaP)	30
		BLUE(Gan)	26
Reverse Current	IR	SUPER HIGH BRIGHT RED(ALGalnP)		100	m  A	Vr=5V
		HIGH BRIGHT RED(GaP/GaALAS)		100
		ORANGE RED(AaAsP/GaP)		100
		YELLOW(GaAsP/GaP)		100
		YELLOW GREEN(GaP/GaP)		100
		BLUE(Gan)		100
Segment TO Ssgment Luminouslntensity Matching Ratio	Iv-m	ALL Models	1:1.5			IF=20mA

PARAMETER	SYMNOL	HIGH BRIGHT RED	SUPER HIGH BRIGHT RED	YELLOW GREEN/ORANGE	YELLOW	BLUE	UNIT
Power Dissipation Per Dice	Pad	50	65	65	65	120	mW
Derating Linear From 25°C Per Segment		0.20	0.25	0.27	0.27	0.33	mA/°C
Continuous Forward Current Per DIce	laf	25	25	30	25
Peak Forward Current Per Dice	lpf	120	120	120	120	mA
Reverse Voltage Per Die	Vr	5	5	5	5	V
Operating Temperatuer	Topr	-25°C  to +85°C
Storage Temperature Range	Tstg	-25°C  to +85°C
Solder Temperature	Tsod	Lead Soldering Temperature 260°C at 1.6mm From Body for 3 second